UV laser marking machine belongs to the series of laser marking machine, but it is developing by 355nm UV laser. The machine uses three-stage intracavity frequency doubling technology to compare with infrared laser. 355 UV focusing spot is very small, can be It greatly reduces the mechanical deformation of the material and has little influence on the processing heat. It is mainly use for ultra-fine marking and engraving. It is especially suitable for marking food, medical packaging materials, micropores, high-speed division of glass materials and silicon. Wafers are using in applications such as complex pattern cutting.
The UV laser marking machine is a series of laser marking machines, so the principle is similar to that of the laser marking machine. They are all marking with a laser beam on the surface of various materials. The effect of marking is to directly break the molecular chain of the substance by a short-wavelength laser (unlike the evaporation of the surface substance produced by the long-wave laser to expose the deep substance) to reveal the pattern and text to etch.
Because the focused laser spot is extremely small and the processing heat affected zone is small, the UV laser can using for ultra-fine marking and special material marking, which is the first choice for customers who have higher requirements for marking. Ultraviolet laser is suitable for processing materials in addition to copper. Not only the beam quality is good, the focusing spot is smaller, and the ultra-fine marking can realize; the application range is wider; the heat-affected area is extremely small, no thermal effect is generate, and material scorch problem does not occur; the marking speed is fast and the efficiency is high; the performance of the whole machine Stable, small size, low power consumption and other advantages.