The application of laser cutting on solar panels-Flora

The application of laser cutting on solar panels

The application of laser cutting technology on solar panels
The application of laser cutting technology on solar panels

Solar panels are more and more common to use. In the past two years, with the rapid development of the new energy industry, solar energy has been gradually applied to all walks of life as an indispensable part of new energy. The popularity of solar panels has greatly promoted the development of the photovoltaic industry. Solar panel applications can be seen everywhere, such as solar lights, solar water heaters, solar air conditioners, etc. They are used in all walks of life.
Common solar panel classification?
1. Crystalline silicon solar cells: polycrystalline silicon solar cells, monocrystalline silicon solar cells.
2. Amorphous silicon panels: thin-film solar cells, organic solar cells.
3. Chemical dye panels: dye-sensitized solar cells, etc.
What are the applications and advantages of laser cutting technology on solar panels?
At present, laser cutting technology is mainly used for cutting wafers and dicing cutting. Due to its non-contact processing and stress-free cutting, the high-precision laser cutting machine can ensure that the raw materials are not damaged to a greater extent and will not damage the internal wafer structure. The cutting quality of products is much better than other cutting methods. At the same time, the characteristics of small slit width, high precision, and adjustable laser power also enable the application of laser precision cutting technology to control the cutting thickness, thereby making it possible to achieve thinning of solar cells.
Laser cutting technology is mainly used in the cutting and scribing, including silicon wafers, anti-reflection scribing of amorphous silicon thin-film batteries, edge-clearing of amorphous silicon thin-films, scribing of amorphous silicon thin-films, monocrystalline silicon and polycrystalline silicon in the solar industry , Scribing (cutting and dicing) and grooves for amorphous silicon cells and silicon wafers.

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