Advantages and Analysis of Laser Processing of Ceramic Substrate PCB

Xintian Laser – Precision Laser Cutting Machine

Traditional mechanical processing

Mechanical processing is a traditional processing technology for ceramic materials and also the most widely used processing method. Mechanical processing mainly refers to turning, cutting, grinding, drilling, etc. of ceramic materials. Its process is simple and processing efficiency is high, but due to the high hardness and brittleness of ceramic materials, mechanical processing is difficult to process engineering ceramic components with complex shapes, high dimensional accuracy, rough surfaces, low roughness, and high reliability.

Mechanical forming processing

It is a secondary processing of ceramic products, which uses special cutting tools for precise mechanical processing on ceramic blanks. It is a special processing in the machining industry, characterized by high appearance and accuracy levels, but low production efficiency and high production costs.

With the continuous advancement of 5G construction, industrial fields such as precision microelectronics and aviation and shipbuilding have further developed, all of which cover the application of ceramic substrates. Among them, ceramic substrate PCBs have gradually gained more and more applications due to their superior performance.

Under the trend of lightweight and miniaturization, traditional cutting and processing methods cannot meet the demand due to insufficient accuracy. Laser is a non-contact machining tool that has obvious advantages over traditional machining methods in cutting technology and plays a very important role in the processing of ceramic substrate PCBs.

Laser processing equipment for ceramic PCBs is mainly used for cutting and drilling. Due to the many technological advantages of laser cutting, it has been widely used in the precision cutting industry. Below, we will take a look at the application advantages of laser cutting technology in PCBs.

Advantages and Analysis of Laser Processing of Ceramic Substrate PCB

Ceramic materials have excellent high-frequency and electrical properties, as well as high thermal conductivity, chemical stability, and thermal stability, making them ideal packaging materials for the production of large-scale integrated circuits and power electronic modules. Laser processing of ceramic substrate PCBs is an important application technology in the microelectronics industry. This technology is efficient, fast, accurate, and has high application value.

Advantages of laser processing ceramic substrate PCBs:

1. Due to the small spot size, high energy density, good cutting quality, and fast cutting speed of the laser;

2. Narrow cutting gap, saving material;

3. Laser processing is fine, and the cutting surface is smooth and free of burrs;

4. The heat affected zone is small.

Ceramic substrate PCBs are relatively fragile compared to fiberglass boards, and require high processing technology. Therefore, laser drilling technology is usually used.

Laser drilling technology has the advantages of high precision, fast speed, high efficiency, scalable batch drilling, applicability to the vast majority of hard and soft materials, and no loss on tools. It meets the requirements of high-density interconnection and refined development of printed circuit boards. The ceramic substrate using laser drilling technology has the advantages of high adhesion between ceramics and metal, no detachment, foaming, etc., achieving the effect of growing together, with high surface smoothness and roughness ranging from 0.1 to 0.3 μ m. The laser drilling aperture ranges from 0.15 to 0.5mm, and can even be fine to 0.06mm.